![]() Furthermore, Molex has a wide range of connectors for almost all connector requirements in nearly all the markets. MicroTPA Wire-to-Board and Wire-to-Wire Connector System is available in 2- to 15-circuit single-row connectors in vertical configurations with TPA retainer. requirements, compact MX64 connectors provide seamless mating possibilities with a variety of automotive sensors Meets all USCAR footprints and testing requirements for 0. ![]() MicroTPA Wire-to-Board and Wire-to-Wire Connector System is a very compact connector system with 2.00mm pitch and positive lock.Ĭustomers choose different connectors from different vendors, this makes their procurement process complex and often causes compatibility issues. Often designers from consumer and vehicle industries have a footprint space issue on their PC board because of increasing demand for more components. Around the world and across industries, Molex is enabling next-generation technology for data centers, vehicles, industrial environments, medical technology, consumer devices and more. MicroTPA vertical high wall header with raised bottom and ledge allows application of potting material to cover the PC board. Cable Assemblies FFC / FPC Connectors Application Tooling We believe in the transformative power of creating connections. Molex offers a wide range of connectors for various applications, such as automotive, backplane, board-to-board, memory, high-speed, high-power and more. Water sensitive consumer applications require potting sealing on their PC board. ![]() High retention force and inner lock provides electrical reliability in rugged environments. Molex Standard and Custom RF Coaxial Connectors and Cable Assemblies from DC to 65 GHz and sizes from ultra-microminiature to large RF connectors. MicroTPA Wire-to-Board and Wire-to-Wire Connector System features terminal design with positive lock for secure mating retention. Complete RF solutions for high-frequency and superior signal integrity, even in the most demanding environments. Rugged automobile and industrial applications can be subject to shock, vibration or rough handling that can dislodge terminals and cause signal interference.
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